SK Hynix
Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won't be business as usual; chip manufacturers are going to need to adopt more advanced packaging methods than are used today to accommodate the wider memory. As part of its European Technology Symposium 2024 presentation, TSMC offered some fresh details into the base dies it will be manufacturing for HBM4, which will be built using logic processes. With TSMC planning to employ variations of their N12 and N5 processes for this task, the company is expecting to occupy a favorable place in the...
SK Hynix Begins Sampling of 96-Layer 1 Tb 3D QLC NAND
SK Hynix recently started sampling of its 1 Tb 96-layer NAND flash memory devices featuring its PUC 3D QLC architecture. The new 1 Tb chip will enable SSD makers...
14 by Anton Shilov on 5/10/2019
Boom to Bust: Memory Makers Plan to Cut NAND Flash Production
A true cyclical market, the NAND flash business goes through periods of booms and periods of busts. Following a very profitable boom year in 2018, it looks like the...
57 by Anton Shilov on 4/26/2019
SK Hynix to Start Using 2nd Gen 10nm-class DRAM Process Technology in 2H 2019
As part of their Q1'19 earnings announcement, SK Hynix has disclosed that the company will both increase its output of DRAM made using its 1st generation 10 nm-class manufacturing...
4 by Anton Shilov on 4/25/2019
SK Hynix Details DDR5-6400
SK Hynix this week revealed some additional technical details about its upcoming DDR5-6400 memory chip at the International Solid State Circuits Conference. The die size of the company’s 16...
10 by Anton Shilov on 2/26/2019
ASML to Ship 30 EUV Scanners in 2019: Faster EUV Tools Coming
ASML said last week that it planned to ship 30 extreme ultraviolet scanners in 2019, up significantly from 2018. The plan is not surprising, as demand for EUV lithography...
17 by Anton Shilov on 1/28/2019
CES 2019: GIGABYTE Aorus RGB Memory Hits DDR4-4000 with SK Hynix ICs
GIGABYTE last year entered the memory market with its Aorus RGB and GIGABYTE-branded DIMMs, designed for enthusiasts. To some degree the project was experimental with conservative DDR4-2666 and DDR4-3200...
3 by Anton Shilov on 1/14/2019
JEDEC Updates HBM Spec to Boost Capacity & Performance: 24 GB, 307 GB/s Per Stack
JEDEC this week published an updated version of its JESD235 specification, which describes HBM and HBM2 DRAM. The new version of the standard allows memory manufacturers to increase capacities...
15 by Anton Shilov on 12/19/2018
SK Hynix Reveals DDR4-3200 Memory Chips with 4 Phase Clocking
SK Hynix this week announced that it has completed development of its latest-generation DDR4 memory chips. The new DRAM chips are made using the company’s second-generation 10 nm-class fabrication...
4 by Anton Shilov on 11/16/2018
SK Hynix Develops First 16 Gb DDR5-5200 Memory Chip, Demos DDR5 RDIMM
SK Hynix on Thursday announced that it had completed development of its first DDR5 memory chip. The new chip offers a capacity of 16 Gb and is said to...
29 by Anton Shilov on 11/15/2018
SK Hynix Launches 96-Layer 3D NAND and Discloses QLC Plans
SK Hynix this week officially launched its new 96-layer 3D NAND flash memory chips, which feature a new architecture and a faster interface. The NAND has already been qualified...
4 by Anton Shilov on 11/8/2018
U.S. Government Indicts Chinese DRAM Maker JHICC on Industrial Espionage; Bans Exports To Firm
The U.S. Department of Commerce this week banned U.S. exports to a China-based maker of DRAM. The DoC believes that Fujian Jinhua Integrated Circuit Company (also known as Fujian...
58 by Anton Shilov on 11/1/2018
KLEVV Launches NEO N500 SSDs Based on SK Hynix’s 72-Layer 3D NAND
SK Hynix’s subsidiary KLEVV has introduced its new client SSDs based on the manufacturer’s 72-layer 3D NAND flash. The KLEVV NEO N500 drives are aimed at entry-level desktops and...
0 by Anton Shilov on 9/14/2018
SK Hynix Set to Build a New Memory Fab
SK Hynix last week announced plans to build another semiconductor fab near its headquarters in Icheon, South Korea. The production facility is not going to be as big and...
16 by Anton Shilov on 7/30/2018
Klevv Adds Kolors: RGB-Lit Enthusiast-Class Cras DIMMs & SSD Incoming
Klevv, a subsidiary of SK Hynix, has been around for quite a while targeting mass retail market with mainstream DRAM and SSD products. Recently Klevv decided to address the...
13 by Anton Shilov on 6/7/2018
Cadence and Micron Demo DDR5-4400 IMC and Memory, Due in 2019
Cadence this week introduced the industry’s first IP interface in silicon for the current provisional DDR5 specification developed by JEDEC. Cadence’s IP and test chip us fabricated using TSMC’s...
31 by Anton Shilov on 5/3/2018
SK Hynix Announces SSDs with 72-Layer 3D NAND ICs, Own Controllers
SK Hynix this week has said it has completed development of its enterprise-grade SSDs based on its 512 Gb 72-layer 3D TLC NAND chips as well as its own...
7 by Anton Shilov on 2/8/2018
SK Hynix Lists GDDR6 Memory as ‘Available Now’, Publishes Final Specs
SK Hynix has updated its product catalogue and now lists its GDDR6 memory chips as “available now”. In addition, the company published final specifications of its GDDR6 product family...
9 by Anton Shilov on 2/6/2018
SK Hynix’s Product Catalog Lists 16 Gb DDR4 Chips, Opens Doors to 256 GB DIMMs
SK Hynix has recently added single-die DDR4 memory chips featuring 16 Gb capacity to its product catalog. The benefit of the increase in single-die capacity is two fold: not...
14 by Anton Shilov on 1/25/2018
Toshiba Signs Deal To Sell Memory Business
After being approved by the board of directors last week, Toshiba's deal to sell their memory business to a consortium led by Bain Capital has been signed and will...
11 by Billy Tallis on 9/28/2017
Toshiba To Proceed With Sale Of Memory Business To Consortium
The latest and possibly final round of bidding for Toshiba's memory business concluded today with Toshiba's board selecting a consortium led by private equity firm Bain Capital as the...
12 by Billy Tallis on 9/20/2017
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